robust design of microelectronics assemblies against mechanical shock temperature and moisture

Robust Design Of Microelectronics Assemblies Against Mechanical Shock  Temperature And Moisture
Author: E-H Wong
Publisher: Woodhead Publishing
Release Date: 2015-05-23
Pages: 482
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study

Directed Self Assembly Of Block Co Polymers For Nano Manufacturing
Author: Roel Gronheid
Publisher: Woodhead Publishing
Release Date: 2015-07-17
Pages: 328
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

The directed self-assembly (DSA) method of patterning for microelectronics uses polymer phase-separation to generate features of less than 20nm, with the positions of self-assembling materials externally guided into the desired pattern. Directed self-assembly of Block Co-polymers for Nano-manufacturing reviews the design, production, applications and future developments needed to facilitate the widescale adoption of this promising technology. Beginning with a solid overview of the physics and chemistry of block copolymer (BCP) materials, Part 1 covers the synthesis of new materials and new processing methods for DSA. Part 2 then goes on to outline the key modelling and characterization principles of DSA, reviewing templates and patterning using topographical and chemically modified surfaces, line edge roughness and dimensional control, x-ray scattering for characterization, and nanoscale driven assembly. Finally, Part 3 discusses application areas and related issues for DSA in nano-manufacturing, including for basic logic circuit design, the inverse DSA problem, design decomposition and the modelling and analysis of large scale, template self-assembly manufacturing techniques. Authoritative outlining of theoretical principles and modeling techniques to give a thorough introdution to the topic Discusses a broad range of practical applications for directed self-assembly in nano-manufacturing Highlights the importance of this technology to both the present and future of nano-manufacturing by exploring its potential use in a range of fields

Advances In Chemical Mechanical Planarization  CMP
Author: Suryadevara Babu
Publisher: Woodhead Publishing
Release Date: 2016-01-09
Pages: 536
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Considers techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for particular materials Addresses consumables and process control for improved CMP

Rare Earth And Transition Metal Doping Of Semiconductor Materials
Author: Volkmar Dierolf
Publisher: Woodhead Publishing
Release Date: 2016-01-23
Pages: 470
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Rare Earth and Transition Metal Doping of Semiconductor Material explores traditional semiconductor devices that are based on control of the electron’s electric charge. This book looks at the semiconductor materials used for spintronics applications, in particular focusing on wide band-gap semiconductors doped with transition metals and rare earths. These materials are of particular commercial interest because their spin can be controlled at room temperature, a clear opposition to the most previous research on Gallium Arsenide, which allowed for control of spins at supercold temperatures. Part One of the book explains the theory of magnetism in semiconductors, while Part Two covers the growth of semiconductors for spintronics. Finally, Part Three looks at the characterization and properties of semiconductors for spintronics, with Part Four exploring the devices and the future direction of spintronics. Examines materials which are of commercial interest for producing smaller, faster, and more power-efficient computers and other devices Analyzes the theory behind magnetism in semiconductors and the growth of semiconductors for spintronics Details the properties of semiconductors for spintronics

Optical Interconnects For Data Centers
Author: Tolga Tekin
Publisher: Woodhead Publishing
Release Date: 2016-11-01
Pages: 428
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. Summarizes the state-of-the-art in this emerging field Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration Contains contributions that are drawn from leading international experts on the topic

Proceedings 1998 International Symposium On Microelectronics
Author: James D. Welterlen
Publisher: Society of Photo Optical
Release Date: 1998
Pages: 1046
ISBN:
Available Language: English, Spanish, And French
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Proceedings Of The     International Symposium On Microelectronics
Author:
Publisher:
Release Date: 1998
Pages:
ISBN:
Available Language: English, Spanish, And French
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1997 International Symposium On Microelectronics
Author: International Microelectronics and Packaging Society
Publisher: Society of Photo Optical
Release Date: 1997
Pages: 707
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Contains the proceedings of IMAPS '97 in Adobe portable document format (PDF).

Mechanical Engineering And Materials Science
Author: M.R. Xue
Publisher: Trans Tech Publications Ltd
Release Date: 2014-12-31
Pages: 1788
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Collection of selected, peer reviewed papers from the 2014 International Conference on Intelligent Mechanics and Materials Engineering (ICIMME 2014), December 27-28, 2014, Shenzhen, China. The 378 papers are grouped as follows: Chapter 1: Materials Science and Processing Technologies, Chemical Processes and Biotechnologies; Chapter 2: Construction and Structural Engineering, Materials and Technologies; Chapter 3: General Mechanical Engineering, Applied Mechanics and Manufacturing, Equipment; Chapter 4: Measurements, Instrumentation, Testing, Monitoring, Analysis and Detection Technologies; Chapter 5: Electronics and Microelectronics, Embedded and Integrated Systems, Communications and Signal Processing, Power and Energy, Electric and Magnetic Systems; Chapter 6: Mechatronics, Robotics, Automation and Control

Materials Processing And Manufacturing III
Author: Xiao Ming Sang
Publisher: Trans Tech Publications Ltd
Release Date: 2013-08-30
Pages: 3444
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Selected, peer reviewed papers from the 3rd International Conference on Advanced Engineering Materials and Technology (AEMT 2013), May 11-12, 2013, Zhangjiajie, China

Functional Manufacturing Technologies And Ceeusro II
Author: Long Chen
Publisher: Trans Tech Publications Ltd
Release Date: 2011-01-20
Pages: 778
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Volume is indexed by Thomson Reuters CPCI-S (WoS). This work brings together peer-reviewed papers on innovations and practical suggestions with regard to engineering & technology; materials science and technology in manufacturing including artificial materials, forming, novel-material fabrication, green manufacturing, design and manufacturing of composite components, surface science and engineering, quality control of manufacturing systems, theoretical, simulation and experimental studies related to microstructures and residual stresses; manufacturing systems and technologies including manufacturing process simulation, CIMS and manufacturing systems, vibration measuring and reliability analysis, finite element analysis and structure optimization, fault diagnosis and maintenance theory, intelligent mechatronics and robotics, elements, structures, mechanisms, and applications of micro and nano systems, compound machine tools, rapid prototyping, printing (e.g. embossing), complex mechanical-electro-liquid systems, PDM, ERP, CRM, FMS, PLM, logistics and supply chains, effect of the machining method or technique upon resultant material mechanical properties, RPM, and management.

International Aerospace Abstracts
Author:
Publisher:
Release Date: 1999
Pages:
ISBN:
Available Language: English, Spanish, And French
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Sensors  Measurement And Intelligent Materials
Author: Yun Hae Kim
Publisher: Trans Tech Publications Ltd
Release Date: 2013-02-13
Pages: 3310
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Volume is indexed by Thomson Reuters CPCI-S (WoS). The papers of this 4 volumes set on "Sensors, Measurement and Intelligent Materials" are grouped as follows: Chapter 1: Intelligent Materials and Structures; Chapter 2: Sensors; Chapter 3: Techniques for Measurement, Detection and Monitoring; Chapter 4: Data Acquisition, Data Mining and Data Processing; Chapter 5: Automation and Control. Technologies and Engineering; Chapter 6: Intelligent System; Chapter 7: Mechatronics; Chapter 8: Microelectronics, Electronics and Electrical. Circuits and Devices; Chapter 9: Network Engineering and Communication Technology; Chapter 10: Applied Computing and Information Technologies; Chapter 11: Materials and Processing Technologies; Chapter 12: Applied Mechanics in General Mechanical Engineering and Construction.

Electrical   Electronics Abstracts
Author:
Publisher:
Release Date: 1997
Pages:
ISBN:
Available Language: English, Spanish, And French
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Information Technology For Manufacturing Systems II
Author: Qi Luo
Publisher: Trans Tech Publications Ltd
Release Date: 2011-06-10
Pages: 2800
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

The 2011 International Conference on Information Technology for Manufacturing Systems (ITMS 2011) was co-sponsored by the University of Adelaide, Australia and Huazhong University of Science and Technology, China. Its mission was to bring together innovative academics and industrial experts in the field of Materials Science and Mechanical Science. Volume is indexed by Thomson Reuters CPCI-S (WoS). The proceedings consist of over 467 peer-reviewed papers which offer an uniquely up-to-date survey of the topic.

Vehicle  Mechatronics And Information Technologies
Author: X.D. Yu
Publisher: Trans Tech Publications Ltd
Release Date: 2013-08-30
Pages: 5174
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Collection of selected, peer reviewed papers from the 2013 International Conference on Vehicle & Mechanical Engineering and Information Technology (VMEIT 2013), August 17-18, 2013, Zhengzhou, Henan, China. The 1094 papers are grouped as follows: Chapter 1: Design and Researches in Area of Vehicle and General Mechanical Engineering; Chapter 2: Mechatronics, Automation and Control; Chapter 3: Measurement and Instrumentation, Monitoring and Detection Technologies, Fault Diagnosis; Chapter 4: Computation Methods and Algorithms for Modeling, Simulation and Optimization, Data Mining and Data Processing; Chapter 5: Information Technologies, WEB and Networks Engineering, Information Security, Software Application and Development; Chapter 6: Power and Electric Systems, Electronics and Microelectronics, Embedded and Integrated Systems; Chapter 7: Communication, Signal and Image Processing, Data Acquisition, Identification and Recognition Technologies; Chapter 8: Information Technologies in Urban and Civil Engineering, Medicine and Biotechnology; Chapter 9: Material Science and Manufacturing Technology; Chapter 10: Information Technology in Management Engineering, Logistics, Economics, Finance, Assessment; Chapter 11: Related Themes.

Applied Mechanics Reviews
Author:
Publisher:
Release Date: 1993
Pages:
ISBN:
Available Language: English, Spanish, And French
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Automation Equipment And Systems
Author: Wen Zhe Chen
Publisher: Trans Tech Publications Ltd
Release Date: 2012-02-27
Pages: 3360
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Volume is indexed by Thomson Reuters CPCI-S (WoS). The present volumes provide up-to-date, comprehensive and world-class state-of-the art knowledge concerning manufacturing science and engineering, focusing on Automation Equipment and Systems. The 633 peer-reviewed papers are grouped into 16 chapters: Material Section; Mechatronics; Industrial Robotics and Automation; Machine Vision; Sensor Technology; Measurement Control Technologies and Intelligent Systems; Transmission and Control of Fluids; Mechanical Control and Information Processing Technology; Embedded Systems; Advanced Forming Manufacturing and Equipment; NEMS/MEMS Technology and Equipment; Micro-Electronic Packaging Technology and Equipment; Advanced NC Techniques and Equipment; Power and Fluid Machinery; Energy Machinery and Equipment; Construction Machinery and Equipment.