reliability and failure of electronic materials and devices

Reliability And Failure Of Electronic Materials And Devices
Author: Milton Ohring
Publisher: Academic Press
Release Date: 2014-11-03
Pages: 758
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

Corrosion And Reliability Of Electronic Materials And Devices
Author: Robert B. Comizzoli
Publisher: The Electrochemical Society
Release Date: 1999
Pages: 292
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Electronic Materials Handbook
Author:
Publisher: ASM International
Release Date: 1989-11-01
Pages: 1224
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

Yield Of Electronic Materials And Devices
Author: National Research Council (U.S.). Ad Hoc Panel on Yield of Electronic Materials and Devices
Publisher:
Release Date: 1972
Pages: 82
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Engineering Materials Science
Author: Milton Ohring
Publisher: Elsevier
Release Date: 1995-11-29
Pages: 827
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Milton Ohring's Engineering Materials Science integrates the scientific nature and modern applications of all classes of engineering materials. This comprehensive, introductory textbook will provide undergraduate engineering students with the fundamental background needed to understand the science of structure-property relationships, as well as address the engineering concerns of materials selection in design, processing materials into useful products, andhow material degrade and fail in service. Specific topics include: physical and electronic structure; thermodynamics and kinetics; processing; mechanical, electrical, magnetic, and optical properties; degradation; and failure and reliability. The book offers superior coverage of electrical, optical, and magnetic materials than competing text. The author has taught introductory courses in material science and engineering both in academia and industry (AT&T Bell Laboratories) and has also written the well-received book, The Material Science of Thin Films (Academic Press). Key Features * Provides a modern treatment of materials exposing the interrelated themes of structure, properties, processing, and performance * Includes an interactive, computationally oriented, computer disk containing nine modules dealing with structure, phase diagrams, diffusion, and mechanical and electronic properties * Fundamentals are stressed * Of particular interest to students, researchers, and professionals in the field of electronic engineering

Reliability Of Semiconductor Lasers And Optoelectronic Devices
Author: Robert Herrick
Publisher: Woodhead Publishing
Release Date: 2020-12-15
Pages: 300
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Reliability of Semiconductor Lasers and Optoelectronic Devices simplifies complex concepts of optoelectronics reliability through a focus on case studies and structured methods. The book provides a brief look at the fundamentals of laser diodes and presents real world case studies that discuss the principles of reliability and what occurs when rules are broken. In addition, the book comprehensively looks at optoelectronics devices and their reliability principles to avoid the most common failure mechanisms and presents key materials and devices, including silicon photonics, high power laser diodes, VCSELS, InGaN LEDs and Lasers, and AlGaN LEDs, and more. Includes case studies and numerous examples of best practices and common mistakes that impact optoelectronics reliability Reviews key failure mechanisms that impact reliability, including degradation and grown-in defects Provides a look at reliability issues for silicon photonics, VCSELS, InGaN LEDs and lasers, AIGaN LEDs, and more

Materials Science Of Thin Films
Author: Milton Ohring
Publisher: Academic Press
Release Date: 2002
Pages: 794
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.

Micro  And Opto Electronic Materials And Structures  Physics  Mechanics  Design  Reliability  Packaging
Author: Ephraim Suhir
Publisher: Springer Science & Business Media
Release Date: 2007-05-26
Pages: 1460
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Materials And Reliability Handbook For Semiconductor Optical And Electron Devices
Author: Osamu Ueda
Publisher: Springer Science & Business Media
Release Date: 2012-09-22
Pages: 616
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Materials and Reliability Handbook for Semiconductor Optical and Electron Devices provides comprehensive coverage of reliability procedures and approaches for electron and photonic devices. These include lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Lifetime predictions for compound semiconductor devices are notoriously inaccurate due to the absence of standard protocols. Manufacturers have relied on extrapolation back to room temperature of accelerated testing at elevated temperature. This technique fails for scaled, high current density devices. Device failure is driven by electric field or current mechanisms or low activation energy processes that are masked by other mechanisms at high temperature. The Handbook addresses reliability engineering for III-V devices, including materials and electrical characterization, reliability testing, and electronic characterization. These are used to develop new simulation technologies for device operation and reliability, which allow accurate prediction of reliability as well as the design specifically for improved reliability. The Handbook emphasizes physical mechanisms rather than an electrical definition of reliability. Accelerated aging is useful only if the failure mechanism is known. The Handbook also focuses on voltage and current acceleration stress mechanisms.

Reliable Design Of Electronic Equipment
Author: Dhanasekharan Natarajan
Publisher: Springer
Release Date: 2014-08-02
Pages: 150
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

This book explains reliability techniques with examples from electronics design for the benefit of engineers. It presents the application of de-rating, FMEA, overstress analyses and reliability improvement tests for designing reliable electronic equipment. Adequate information is provided for designing computerized reliability database system to support the application of the techniques by designers. Pedantic terms and the associated mathematics of reliability engineering discipline are excluded for the benefit of comprehensiveness and practical applications. This book offers excellent support for electrical and electronics engineering students and professionals, bridging academic curriculum with industrial expectations.

Hermeticity Of Electronic Packages
Author: Hal Greenhouse
Publisher: William Andrew
Release Date: 2011-10-05
Pages: 360
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the package├╣especially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to solve another. Thus, the book provides a ready reference to help deal with day to day issues as they arise. The book gathers in a single volume a great many issues previously available only in journals├╣or only in the experience of working engineers. How to define the ""goodness"" of a seal? How is that seal measured? How does the integrity of the seal affect circuit reliability? What is the significance of the measured integrity of the seal? What is the relationship of Residual Gas Analysis and the seal integrity? The handbook answers these questions and more, providing an analysis of nearly 100 problems representative of the wide variety of challenges that actually occur in industry today.

Power Electronic Devices  Applications  Failure Mechanisms And Reliability
Author: Francesco Iannuzzo
Publisher: Energy Engineering
Release Date: 2020-10-27
Pages: 300
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Power devices are key to modern power systems, performing essential functions such as inverting and changing voltages, buffering and switching. The increasing complexity of power systems, with distributed renewable generation on the rise, is posing challenges to these devices. In recent years, several new devices have emerged, including wide bandgap devices, each with advantages and weaknesses depending on circumstances and applications. With a device-centric approach, this book begins by introducing the operating principles of all key power electronic components present in today's power electronics. Further chapters cover junction diodes, thyristors, silicon MOSFETs, silicon IGBTs, IGCTs, SiC MOSFETs, GaN metal-insulator-semiconductor field-effect transistors (MIS-FETs), gallium nitride vertical transistors, module design and reliability, switching cell design, and modern insulated gate bipolar transistor (IGBT) gate driving methods for robustness and reliability. A final chapter outlines the prospects and outlooks in power electronics technology and its market. This book addresses power device technology at the design level, by bridging the gap between semiconductor and materials science and power electronic applications. It provides key information for researchers working with power electronic devices and for power electronic application designers, and it is also a useful resource for academics and industrial researches working on power electronics at the system level, such as industrial machine designers and robot designers.

Physics Of Failure In Electronics
Author: Morton E. Goldberg
Publisher:
Release Date: 1965
Pages: 648
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

The purpose of the meeting was to exchange information on fundamental physical and chemical processes which contribute to degradation, aging, and failure of electronic parts and materials. Emphasis was placed on the application of this information to the problems of reliability control, measurement, prediction, and improvement. Papers were presented at six half-day sessions as follows: Session I - Interconnections; Session II - Test, Analysis, and Correlation; Session III - Device Physics; Session IV - Surface Effects; Session V - Bulk Effects; Session VI - Minuteman II CQAP Program. Included in this volume are also a number of standby papers which were not presented at the symposium.

The Electronic Packaging Handbook
Author: Glenn R. Blackwell
Publisher: CRC Press
Release Date: 2017-12-19
Pages: 640
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

International Symposium On Electronic Materials And Packaging
Author:
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
Release Date: 2000
Pages: 478
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Topics covered by this title include: flip chip running; solder join reliability; emerging technologies; solder materials; delimitation; polymers for packaging; design and process; modelling and testing; material characterization; and package reliability.

Plastic Encapsulated Microelectronics
Author: Michael Pecht
Publisher: Wiley-Interscience
Release Date: 1995-02-20
Pages: 474
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Until now, professionals in search of detailed information about the latest developments in PEM design and production have had to waste valuable time browsing through countless professional journals, monographs, and databases.

Electromigration In Thin Films And Electronic Devices
Author: Choong-Un Kim
Publisher: Elsevier
Release Date: 2011-08-28
Pages: 352
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area. Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part three covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chip solder joints. With its distinguished editor and international team of contributors, Electromigration in thin films and electronic devices is an essential reference for materials scientists and engineers in the microelectronics, packaging and interconnects industries, as well as all those with an academic research interest in the field. Provides up-to-date coverage of the continued development of advanced copper interconnects for integrated circuits Comprehensively reviews modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation, and x-ray microbeam studies of electromigration Deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure

Reliability Engineering For Electronic Design
Author: Norman Fuqua
Publisher: CRC Press
Release Date: 1987-01-01
Pages: 406
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

This book addresses the needs of electronic design engineers, reliability engineers, and their respective managers, stressing a pragmatic viewpoint rather than a vigorous mathematical presentation.

New Research On Semiconductors
Author: Thomas B. Elliot
Publisher: Nova Publishers
Release Date: 2006
Pages: 216
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

Includes within its scope, topics such as: studies of the structural, electrical, optical and acoustical properties of bulk, low-dimensional and amorphous semiconductors; and, interface properties, including the physics and chemistry of heterojunctions, metal-semiconductor and insulator-semiconductor junctions.

Frontal Semiconductor Research
Author: Oliver T. Chang
Publisher: Nova Publishers
Release Date: 2006
Pages: 219
ISBN:
Available Language: English, Spanish, And French
EBOOK SYNOPSIS:

This book includes within its scope studies of the structural, electrical, optical and acoustical properties of bulk, low-dimensional and amorphous semiconductors; computational semiconductor physics; interface properties, including the physics and chemistry of heterojunctions, metal-semiconductor and insulator-semiconductor junctions; all multi-layered structures involving semiconductor components. Dopant incorporation. Growth and preparation of materials, including both epitaxial (e.g. molecular beam and chemical vapour methods) and bulk techniques; in situ monitoring of epitaxial growth processes, also included are appropriate aspects of surface science such as the influence of growth kinetics and chemical processing on layer and device properties. The physics of semiconductor electronic and optoelectronic devices are examined , including theoretical modelling and experimental demonstration; all aspects of the technology of semiconductor device and circuit fabrication. Relevant areas of 'molecular electronics' and semiconductor structures incorporating Langmuir- Blodgett films; resists, lithography and metallisation where they are concerned with the definition of small geometry structure. The structural, electrical and optical characterisation of materials and device structures are also included. The scope encompasses materials and device reliability: reliability evaluation of technologies; failure analysis and advanced analysis techniques such as SEM, E-beam, optical emission microscopy, acoustic microscopy techniques; liquid crystal techniques; noise measurement, reliability prediction and simulation; reliability indicators; failure mechanisms, including charge migration, trapping, oxide breakdown, hot carrier effects, electro-migration, stress migration; package- related failure mechanisms; effects of operational and environmental stresses on reliability.